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Thursday, January 27, 2005

Welcome to XFPMSA.org

About the 10 Gigabit Small Form Factor Pluggable (XFP) Multi Source Agreement (MSA) Group

The goal of the XFP MSA Group is to create a specification for a module, cage hardware, and IC interfaces for a 10 Gbit hot pluggable module converting serial electrical signals to external serial optical or electrical signals. The technology is intended to be flexible enough to support OC192/STM-64, 10 G Fibre Channel, G.709, and 10 G Ethernet, usually with the same module. The module design and the volume of production are expected to enable very low cost 10 G solutions. chart Australian Dollar/Canadian Dollar

The XFP group brings together leading networking, system, optical module, semiconductor and connector companies from both the telecommunications and datacommunications markets. Founding member companies include Broadcom Corporation, Brocade, Emulex Corporation, Finisar, JDS Uniphase, Maxim Integrated Products, ONI Systems, ICS (a Sumitomo Electric company), Tyco Electronics and Velio.

The XFP "10 Gigabit Small Form Factor Pluggable" group is developing a Multi-Source Agreement for a next generation optical transceiver. Specifications of this MSA will include a module, cage hardware, and IC interfaces for a 10 Gbit hot pluggable module converting serial electrical signals to external serial optical or electrical signals. The technology is intended to be flexible enough to support OC192/STM-64, 10 G Fibre Channel, G.709, and 10 G Ethernet, usually with the same module. The module design and the volume of production are expected to enable very low cost 10 Gb/s solutions. chart EURGBP

XFP Applications:

  • OC192/STM-64 9.95 Gb/s
  • 10 Gigabit FC 10.5 Gb/s
  • G.709 10.7 Gb/s
  • 10 Gigabit Ethernet 10.3 Gb/s
  • Smaller space and lower cost alternative to parallel-optics VSR.

    • XFP Value Propositions

  • Protocol Agnostic - "any application, any rate".
  • Allows 16 XCVRs on a typical 19" rack with 23mm pitch density.
  • Single footprint for all links.
  • Less than 1/3 the power and size of an MSA with parallel interface.
  • Hot plugable.

    • XFI (10 Gigabit Serial Electrical Interface) Electrical Signaling

  • Supports 12" of FR4 with one connector
  • Low EMI and power due to nominal 500 mV differential drive.
  • Slew control for improved Signal Integirty and lower EMI.
  • TX and RX signals each are a 100 Ohm differential pair, AC coupled for simplicity.

    • Specification Development

    Mechanical / Form Factor
  • Module size Euro to Swiss Franc
  • Electrical connector
  • Guidance and retention
  • Thermal analysis
  • Thermal measurement standard


    • Electrical
  • PCB and connector measurement and modeling
  • Electrical levels
  • Jitter specifications
  • Hosting board reference design
  • Eye opener Specifications
  • Power supplies and max PD
  • EMI containment
  • Electrical compliance measurement standard




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